Laser lithography

 

The LPKF ProtoLaser LDI (laser direct imaging) system for structuring on UV resist-covered substrates.

System:

 
 

Protolaser LDI, laser beam: 375nm; two diameters: fine (~0.8 um), coarse (~3 um)

Field size, usual applications:

 
 

300 microns

Writing speed:

 
 

100 kHz beam positioning inside one writing field

Stage accuracy:

 
 

+- 2.5 microns

Pattern design:

 
 

Software is CAD based, usual CAD formats (awg, scv) can be used with it. Arbitrary shapes can be drawn.

Substrate:

 
 

glass, silicon,…; substrate measures up to 10 cm x 10 cm

Resist:

 
 

AZ (Allresist Gmbh.), coating: spinner: 2000-6000rpm/min; baking 100°C for 50 s on a hot plate

Developer:

 
 

AZ developer: deionised water = 1 : 5, 50 s

Stopper:

 
 

deionised water

Metal deposition:

 
 

sputtering, PECS Gatan Inc.

Lift-off:

 
 

acetone, at least 2 hours at 45°C